Tin in solder or some other meals can form spiky crystals when under stress. These whiskers can form short circuits if not properly insulated or not alloyed with other metals.
Tin in solder or some other meals can form spiky crystals when under stress. These whiskers can form short circuits if not properly insulated or not alloyed with other metals.
Electromigration in ICs typically occurs in metal interconnect, so there are no dopants there to move. Dopants are added to the silicon substrate.
I’ll have to look this up cause now I have like three more questions. Thanks!