• Huawei’s new Kirin 9050 Pro is being called its “most powerful” all-Chinese chip tech giant has ever made

  • Huawei is claiming a 55% density gain by ‘folding’ its chip in half and stacking it instead of shrinking the actual die

  • The chip still uses US hardware and foreign technology to manufacture, including ASML scanners and pre-2022 Applied Materials and Lam Research equipment

  • Athena5898 [any]@hexbear.net
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    8 hours ago

    Keep seeing all this stuff about tech components China is making. Is it even possible at all for someone in America to get some of this?

  • insurgentrat [she/her, it/its]@hexbear.net
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    20 hours ago

    Pretty cool, solid achievement.

    Breaking the stranglehold that USA/ROK/TW have on high end IC manufacturing can only be beneficial.

    Not really into silly expensive bougie phones but new tech usually comes out like this.

    Given the inscrutability of hardware in general, and the desire for 5 eyes to maintain their own backdoors/not give other nations any I suspect competitive chinese chips will end up banned in 5 eyes nations and allies tho :(

    TBH I’d prefer a government halfway across the world that doesn’t give a shit about me being able to spy on me than my own but obviously no state is keen on citizen’s privacy.

  • Big [any, any]@hexbear.net
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    23 hours ago

    The chip powers the Mate XT 2, the third device in the company’s tri-fold line, which starts at 19,999 yuan (~$2,980), and went on sale in China on September 12 2026.

    Holy jesus, that price made me spit out my coffee

    • free_casc [comrade/them]@hexbear.net
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      20 hours ago

      Tbf it’s the device that unfolds along two hinges to become a full size tablet. IPhone duo is the same proce but has a smaller screen when open (but obviously has all yhe apple stuff including decent hardware quality, idk where the XT2 stands on that now that its been out a couple years).

  • culpritus [any]@hexbear.net
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    1 day ago

    The LogicFolding design is really interesting. I’m eager to see benchmarks to confirm the performance improvements. If it pans out, they have opened a whole new avenue of chip design beyond the diminishing returns of Moore’s law.

    LogicFolding splits logic across two active silicon layers bonded face to face, with roughly 50 million vertical interconnects at a pitch of about 1.5 micrometers. Because signals travel shorter distances, Huawei says it could lower operating voltage while raising density.

    That’s a lot of interconnects!

    • Blazkowicz [none/use name]@hexbear.net
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      23 hours ago

      I had always assumed the flat approach was done due to heatsink requirements. I expect strong performance from their approach but I’m far more interested to see operating temperature under load since that will impact lifespan of the chip. Reducing power loss (presumably with the lower voltage) may balance that out effectively

  • bdonvrA
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    20 hours ago

    Man I wish band compatibility didn’t make using cool phones so hard here even if I did import them